Ferric is a technology startup based in New York City that is pioneering an entirely new approach to power delivery for Integrated Circuits and Electronic Assemblies. This approach leverages Ferric’s integration of thin-film magnetic inductors with CMOS technology to enable a significant improvement in the integration density and efficiency of voltage regulators (VRs) compared with current commercially available technologies.
As a Component PCB and Package Design Engineer, you will gain exposure to the full product-life of Ferric’s ICs by working with a diverse cross-functional team including IC designers, test & application engineers, component designers, engineering vendors, the fab, and our customers. Your primary responsibilities will be designing and simulating discrete circuit components and integrating them in a full system PCB. This position requires a background in component analysis, PCB layout best practices and experience in transitioning from simulation software to physical designs. Applicants should be self-motivated and willing to take full responsibility for finding engineering solutions. They must have excellent problem-solving and analytical skills, as well as excellent oral and written communication skills to work well and contribute to a team.
Primary Responsibilities:
Schematic and layout design for PCBs used for the validation, evaluation, and/or demonstration for Ferric’s products
Layout design for organic package substrates or HDI substrate or IC substrate used for the for Ferric’s products
Extracting and modeling of PCB Power Delivery Networks (PDN) and Clock Routing for estimation of parasitic effects
Support design engineers to simulate and modeling of magnetic devices such as transformers and inductors for circuit level simulations
Designing and selecting components for PCBs in power conversion applications and device measurements
Working with circuit design teams for full system analysis in the inclusion of the aforementioned extractions
Collaborate with Ferric’s circuit, test, and applications teams to ensure that PCB and package designs meet requirements
Bench-level verification of PCB / package performance
Analyzing RF performance of various physical components
Developing, maintaining, and executing MATLAB and Python scripts to analyze device performance and automation of FEA simulations
Generating compact models of our devices for simulation in Cadence Spectre
Desired Skills and Experience:
Education: Bachelor’s or Master’s Degree in EE
Industry Experience: 1-5 years
Experience with PCB design and assembly, including component selection, soldering, etc.
Strong Understanding of PCB and package substrate parasitics and PDN extraction
Knowledge of magnetic concepts and design, such as reluctance circuitry, magnetic losses and magnetic saturation
Knowledge of DC-DC power converters/regulators (Buck, Boost, Buck-Boost, LDO, etc.)
Understanding of s-parameter analysis, de-embedding techniques and conversion between RF parameters
Programming Languages: Python, MATLAB
Lab experience with the following equipment: Oscilloscope, Digital Multimeter (DMM), Spectrum Analyzer, Vector Network Analyzer (VNA)
Software: Cadence Allegro Package Designer, Cadence Virtuoso Suite, Cadence Spectre, HSPICE, HFSS, SIwave, Xilinx ISE, and Linux
Desired Characteristics & Attributes::
Passionate, self-starter with strong commitment to flawless execution
Excellent written and verbal communication skills required
Ability to work well with others in a fast-paced collaborative team environment
Location: New York, NY
Eligibility: Applicant must currently be eligible to work for any employer in the US. Visa sponsorship is not available for this position.
Compensation: Base salary range for this position $80k-115k with additional equity and benefits
To apply please email your resume to careers@ferricsemi.com. Ferric is unable to provide sponsorship for employment visa status for this position.