Ferric’s power experts are at HotChips 2024 to exhibit our latest IVR products with interested customers. If you have a a product that benefits from Size, Weight and Power savings, you should consider Ferric’s latest DC-DC converter products! Please come by and see us!
Ferric CEO Noah Sturcken to discuss Integrated Voltage Regulators during Luncheon Keynote at IEEE's Custom Integrated Circuit Conference (CICC)
Ferric’s CEO, Noah Sturcken, will give the Luncheon Keynote at the Custom Integrated Circuit Conference in Denver on April 23rd. Dr. Sturcken’s presentation, “Integrated Voltage Regulators: from Research to Production” will describe his experience developing Integrated Voltage Regulators (IVRs) over the past 16 years, from concepts and basic material research to complete modular IVR products that are currently available from Ferric, the industry leading IVR company co-founded by Dr. Sturcken.
Ferric to Exhibit at GOMAC 2024 in Charleston
Ferric’s power experts are exhibiting at GOMAC 2024 to exhibit our latest IVR products with interested customers. If you have a a product that benefits from Size, Weight and Power savings, you should consider Ferric’s latest DC-DC converter products!
Ferric to Exhibit at ChipletSummit 2024
Ferric’s power experts are exhibiting at the 2024 ChipletSummit to discuss our latest IVR products with interested customers. If you have a high performance digital design, please come talk to us!
Ferric CEO, Noah Sturcken, will present at next Power Electronics Society Webinar on Integrated Power Management for High Performance Processors
Ferric CEO Noah Sturcken will present at the next #PELS webinar - Integrated Power Management for High Performance Processors using IVR Chiplets. We are excited to share our latest developments on this topic!
Thursday 1st February 2024 at 12:00 AM ET.
Register here: https://buff.ly/48G4NgG
Ferric partner, North Eastern Microelectronics Hub (NEMC), awarded $19.7M from Federal CHIPs Act
Deputy Secretary of Defense Kathleen Hicks announced the award of $238 million in "Creating Helpful Incentives to Produce Semiconductors (CHIPS) and Science Act" funding for the establishment of eight Microelectronics Commons (Commons) regional innovation hubs.
This is the largest award to date under President Biden's CHIPS and Science Act.
"The Microelectronics Commons is focused on bridging and accelerating the lab-to-fab transition, that infamous valley of death between R&D and production," said Deputy Secretary Hicks. "President Biden's CHIPS Act will supercharge America's ability to prototype, manufacture, and produce microelectronics scale. CHIPS and Science made clear to America — and the world — that the U.S. government is committed to ensuring that our industrial and scientific powerhouses can deliver what we need to secure our future in this era of strategic competition."
Ferric’s partner hub, the North Eastern Microelectronics Hub (NEMC), has been awarded $19.7M from the program for the maturation of hardware systems, including those that integrate Ferric’s breakthrough power converter technology.
Ferric demonstrates breakthrough IVR technology at HotChips
Ferric will exhibit at HotChips 2023, the premier venue in Silicon Valley for technical disclosures on the industry’s latest high-performance processing chips. Ferric’s industry leading power converter technology enables dramatic area, power and cost savings which are critical performance metrics for processing chips. Ferric’s power solutions are indispensable for next generation computing solutions and are being aggressively adopted by the industry’s leading processor vendors.
Ferric begins shipping Fe1736 and Fe1728 Evaluation Units to Alpha Customers
We are thrilled to announce that Ferric is now shipping Fe1736 and Fe1728 evaluation units to alpha customers! Please contact us if you are interested.
Noah Sturcken Presents at PowerSoC Corridor Webinar
Ferric CEO Noah Sturcken presents Ferric's vision for next generation Integrated Voltage Regulators at the PowerSoC Corridor Webinar Series. The high level of integration achieved with Ferric's integrated power inductors and circuit systems enables efficient, high current density power conversion to occur directly in an SoC package or even in an SoC chip stack.
EE Times, Editor-in-Chief, Brian Santo, interview with Ferric President and CEO, Noah Sturcken
The interview at the International Solid-State Circuit Conference (ISSCC) on February 17th, 2020 starts at approximately the 26:15 minute point of the podcast and it begins with Brian Santo mentioning Ferric’s inclusion in the EE Times list of Silicon 60 Hot Startups in 2014.
https://www.eetimes.com/podcasts/live-from-embedded-world-isscc-and-sorta-mobile-world-congress/
Electronics Weekly.com discusses Ferric's Fe1038 power converter advantages
Deeply-on-chip magnetics make agile PCUs and slash PCB footprint
New York-based fabless chip firm Ferric has teamed up with TSMC to put magnetic components on the metal layers of integrated circuits.
The first product of the collaboration, Fe1038D, has a 2.0 x 3.2mm flip-chip die (<400μm thick) that includes all magnetics and passives needed to deliver 3A at between 0.6V and 1.5V from 1.8V-2.5V, with efficiency peaking above >85%.These chips can also be ganged together to deliver up to 12A.Internal switching frequency, according to the firm, is programmable across 60 – 100MHz, and >10MHz regulation bandwidth is claimed for the technology.
Control is over PMBus 1.3 and the device includes dynamic voltage scaling, programmable soft start, programmable ramp rates, auto phase shedding, temperature monitoring and automated protections including under-voltage lock-out, over-current, over-voltage and temperature. “The Fe1038D multi-phase dc-dc buck converter with integrated inductors allows customers to implement designs with significantly smaller form factors,” according to Ferric CEO Noah Sturcken. “Ferric’s mobile, FPGA, and embedded solutions customers of the Fe1038D are creating their next generation products.”
Delivered in die form, the part can be integrated directly into the packaging of the load IC – i/o pitch is 180μm – and the intellectual property is also available for monolithic integration by TSMC into third party chips.
“Power converter designs are available in single-chip PVR [package integrated voltage regulator, see below] format for in-package integration and also available as licensable hard and soft circuit IP for MVR [monolithic integrated voltage regulator] implementations in TSMC N28 and N7. All necessary circuit sub-systems and interfaces with dedicated integration support for both circuit IP and inductors are offered,” according to Ferric, noting that the designs are still under development.
The thin-film magnetic core inductors can be integrated on top of the chip or interposer. “By integrating inductors with TSMC’s CMOS back-end-of-line, we enable on-package power conversion at any process node,” said Ferric, which claims 20A/mm2 current density for its topology, and near 100% utilisation factor.
Fe1038D samples are available and shipping.
Ferric Demonstration Selected for ISSCC Industry Showcase 2020
The International Solid-State Circuits Conference (ISSCC) is the foremost global forum for presentation of advances in solid-state circuits and system-on-a-chip (SOC). The Conference offers a unique opportunity for engineers working at the cutting edge of IC design and application to maintain technical currency, and to network with leading experts. As part of the 2020 program, ISSCC 2020 will host a choice of five all day events including an Advanced Circuit Forum entitled “Power Management as an Enabler of Future SoCs”. Ferric was selected by invitation to showcase their Package Voltage Regulators (PVRs) which integrate proprietary thin film integrated inductor technology, digital interface, power management, voltage control and power train circuitry during this session. Ferric's integration of patented thin-film magnetic inductors with CMOS technology provides industry leading Power Management Integrated Circuits (PMICs) with the highest efficiency and integration density. The Advanced Circuit Forum at the ISSCC event will take place on February 20th, 2020 at the San Francisco Marriott Marquis Hotel.
Ferric and TSMC Team for Voltage Regulators - 3D InCites
The IMAPS International Symposium in Boston, MA last month highlighted Ferric’s paper that describes Ferric’s Package Voltage Regulators (PVRs) that are the industry’s first single-chip power converters with thin-film magnetic integrated inductors. Ferric’s integrated thin-film inductors offer the advantage of smaller size, lower power consumption, and lower cost. The link to an article from 3DInCities from the IMAPS International Symposium below summarizes the advantages of Ferric’s technology.
DARPA selects Ferric for SBIR/STTR Success Report
The Defense Advanced Research Projects Agency (DARPA), has identified Ferric's development of DC-DC power converter chiplets as a model of a successful collaboration from government investment that results in commercialization of breakthrough technology,
Ferric, with the support of DARPA’s Common Heterogeneous IP and Reuse Strategies (CHIPS) program, has successfully developed commercially viable power converters with integrated ferromagnetic thin-film power inductors.
The DARPA success report can be viewed at the following link: https://www.darpa.mil/attachments/Ferric-Inc-Success-Report.pdf
Noah Sturcken, President and CEO of Ferric, Co-Presents session with TSMC's Vice President of R&D at PwrPak 2019
On October 31st, 2019, Noah Sturcken, President and CEO of Ferric, Inc., and Alex Kalnitsky, TSMC Fellow and Vice President of Research and Development, presented a technical update on TSMC’s integrated voltage regulator manufacturing capabilities including Ferric's thin-film ferromagnetic power inductors at the PwrPACK2019 event in Phoenix, AZ.
“Ferric’s close collaboration with TSMC has resulted in a commercially viable technology that allows for the high volume production of voltage regulators with integrated inductors. We believe that this is a disruptive technological development that will soon be implemented broadly in mobile, datacenter, machine-intelligence and other markets where power consumption, space or cost are critical bottlenecks.” said Noah Sturcken.
http://pwrsocevents.com/pwrpack-technical-program/
About TSMC:
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s largest dedicated semiconductor foundry ever since. The company supports a thriving ecosystem of global customers and partners with the industry’s leading process technology and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. TSMC is headquartered in Hsinchu, Taiwan. For more information about TSMC, please visit http://www.tsmc.com.
Ferric selected for award by DOE's HPC4Mfg program
Ferric has been awarded $300,000 by the U.S. Department of Energy to develop new design automation tools for on-chip magnetic components. "Ferric's partnership with the DOE will leverage high-performance computing resources to dramatically reduced the cycle time and cost associated with designing power converters with integrated magnetic devices," said Mike Lekas, Director of Engineering, Ferric. You can read more about the award and the HPC4Mfg program here by clicking on Fall 2018:
Tom Deitrich, Ferric board member, appointed CEO of Itron
Ferric Announces the Industry’s First Commercially Available Single Chip Power Converter with Integrated Magnetic Inductors.
The Fe1038D replaces traditional step-down buck converters and all necessary passive components with a single chip.
Ferric, Inc. announces today, the industry’s first and only commercially available single-chip power converter with integrated magnetic thin-film power inductors. The Fe1038D is a synchronous 3A step-down converter suitable for powering high performance digital, analog and mixed signal loads, such as microprocessor IO, applications processors and FPGAs. The Fe1038D is a complete power converter on a chip, including all necessary passive components, which allows for direct integration into the packaging of the load IC.
The Fe1038D includes an 8-phase buck converter with fully integrated powertrain, including Ferric’s magnetic thin-film power inductors. The Fe1038D is a flip-chip die with low profile (150μm) and integrates digital interface, power management, voltage control and power train circuitry. The Fe1038D achieves high efficiency over wide load conditions, and low peak-to-peak output voltage ripple. The buck delivers up to 3A continuous output current at an output voltage range of 0.6V to 1.5 V, all in one FC (Flip Chip) 59 Cu bump, 2.0mm x 3.2mm die.
“The Fe1038D multi-phase DC-DC buck converter with fully integrated inductors allows customers to implement new designs with significantly smaller form factors, lower power consumption, and a lower overall bill of materials cost” according to Noah Sturcken, President and CEO of Ferric, Inc. “Ferric’s mobile, FPGA, and embedded solutions customers of the Fe1038D are creating their next generation products that will be much smaller and more efficient than currently available solutions.”
Features:
8-phase interleaved buck with fully integrated power switches, thin-film magnetic power inductors
Efficiency > 85%
1.8V-2.5V Input Voltage
0.6V-1.5V Programmable Output Voltage
3A Output Current
12A Output Current in gang mode
Small footprint
2.0mm × 3.2mm
180μm IO Pitch
Low Profile
<400μm
Dynamic Voltage Scaling (DVS)
Digital Power Management Interface (PMBus 1.3)
Programmable switching frequency: 60-100MHz
Programmable soft start
Load and Line Regulation
Programmable Ramp Rates
Auto Phase Shedding
On-chip power temperature monitor
Under Voltage Lockout, Over Current, Over Voltage and Thermal Protection.
Typical Applications:
Systems-in-Package (SiP)
High performance multi-core system-on-chip (SoC) and FPGA
Smart phones
Laptops
Portable Devices
Embedded industrial systems
Availability
Fe1038D samples are available and shipping to major OEMs. Samples and evaluation boards are available for qualified customers. For more information on the Fe1038D, please visit www.ferricsemi.com.
About Ferric, Inc.
Ferric, Inc. is a venture-backed fabless semiconductor company located in New York City. Ferric is commercializing innovative DC-DC power converter chips and circuit IP based on patented thin-film power inductors for customers in both mobile and computing spaces.
About New Science Ventures
New Science Ventures, LLC (NSV) is a leading venture capital firm focused on building companies that leverage breakthrough science to create extraordinary value. NSV invests in companies using science-based innovations to address market needs in Life Sciences (pharmaceuticals, biologics, medical devices, and diagnostics) and Information Technology (e.g., high-performance semiconductors, cellular infrastructure, sensor networks, enterprise software, and storage) sectors.
Ferric President and CEO, Dr. Noah Sturcken, to Speak at PwrSoC 2018 about Integrated Power Management with Ferromagnetic Thin-Film Power Inductors
Celebrating its 10th anniversary, the International Workshop on Power Supply on Chip (PwrSoC) is the leading international forum for the discussion of the challenges and opportunities, in technology, business and supply-chain, to be considered in advancing the miniaturization and integration of power conversion and power management solutions.
Dr. Noah Sturcken, Ferric’s President and CEO will be speaking during the Integrated Magnetics Session on Thursday, October 18th at the PwrSoC 2018 International Workshop in Hsinchu, Taiwan.
The integration of inductors with thin film magnetics represents a significant advancement for Power Supplies on Chips by reducing power consumption, allowing smaller footprint designs, and reducing the overall bill of materials. Ferric has already seen significant commercial and government adoption of its integrated magnetic thin film inductor technology. This session will discuss the enormous benefits of thin film integrated inductor technology, Ferric’s latest capabilities and the technical challenges that were overcome to offer Ferric’s commercially available integrated inductor solution for Power Supplies on Chips.
“The PwrSoC International Workshop attracts the top leaders from both industry and academia to discuss and advance the field of Power Supplies on Chips. Ferric is honored to participate in this workshop as a Platinum Partner” said Dr. Sturcken. “Ferric’s thin-film ferromagnetic inductor technology offers unparalleled benefits for Power Supply on Chip implementations and has been production qualified with strategic partners.”
Ferric’s commercially available integrated magnetic thin film inductor technology reduces power consumption, allows smaller footprint designs, and reduces overall bill of materials for power supply on chip implementations.Ferric offers complete single-chip power converters, including all necessary passive components, which allows for direct integration into the packaging of a load IC.
Ferric President and CEO, Dr. Noah Sturcken, Speaks on ECCE Panel on “Advancements, Challenges, and End-Games in Power Supply on Chip (PwrSoc)"
The Tenth Annual IEEE Energy Conversion and Exposition (ECCE 2018) held in Portland, Oregon is the pivotal international conference and exposition event on electrical and electromechanical energy conversion field.
Dr. Noah Sturcken, Ferric’s President and CEO spoke on the panel ECCE 2018 in Portland, Oregon on September 26 th , 2018 to discuss how integrated magnetic thin film inductors advance and contribute to the challenges faced by power supply on chip (PwrSoC) development. “The ECCE event had excellent participation from industry leaders in the field of energy conversion and integrated power management, sharing their perspective of the challenges that our industry currently faces. It was an honor to join this panel” said Dr. Sturcken. “The integration of inductors with Ferric’s thin film magnetics technology addresses many of these challenges and we are seeing significant momentum and adoption of Ferric’s technology into the next generation of power supply on chips.”
Ferric’s commercially available integrated magnetic thin film inductor technology reduces power consumption, allows smaller footprint designs, and reduces overall bill of materials for power supply on chip implementations. Ferric offers complete power converters on a chip, including all necessary passive components, which allows for direct integration into the packaging of the load IC.
Read more about the 2018 Energy Conversion Congress and Expo (ECCE) here: